DH-200 Semi-automatic iphone bga rework station
DH-200 Semi-automatic iphone bga rework station
Category：HR BGA rework station
Dinghua automatic mobile surface mount soldering tools DH-200
 
 
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Total Power
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2300W
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Top hot air heater
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450W
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Bottom diode heater
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1800W Newest heating type 2015
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Power
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AC220V±10％ 50Hz
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Lighting
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Taiwan led working light, any angle adjusted.
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Operation mode
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High definition touch screen, intelligent conversational interface, digital system setting
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Storage
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5000 groups
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Top heater movement
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Automatic up / down with button, manual Right/left,
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Bottom diode heating
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Manual right / left movement.
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Positioning
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Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures.
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Temperature control
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K sensor, close loop
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Temp accuracy
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±2℃
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PCB size
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Max 170×220 mm Min 22×22 mm
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BGA chip
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2x2 mm - 80x80 mm
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Minimum chip spacing
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0.15mm
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External temper sensor
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1pc
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Dimensions
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L540*W310*H500mm
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Net weight
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16KG
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