The carrier is a common printed circuit board substrate, the chip is connected by a wire bonding method to the carrier surface, a plastic molded eutectic solder ball array is connected to the carrier surface.

Advantages: the relatively low cost of the package; QFP and compared not susceptible to mechanical damage; electronic assembly for large quantities; PCB substrate with the same font, almost the same thermal expansion coefficient, when the welding, very little correspondence stress on joints Reliability is also less affected.

Disadvantages: easy to absorb moisture.

CBGA

Multilayer ceramic carrier is connected to the ceramic chip carrier may have two forms: a wire bonding; flip chip technology

Advantages: excellent electrical and thermal performance; both good sealing; QFP and compared not susceptible to mechanical damage; suitable I / O electronics assembly is greater than 250.

Disadvantages: the PCB different thermal expansion coefficients when the large package size, resulting in failure of the thermal cycle correspondence.

CCGA

CBGA CCGA is larger than the size of 32 * 32mm when another form, except that instead of using the solder balls of solder columns. Solder column using eutectic solder connection or direct-mounted at the bottom of a ceramic casting.

CCGA substantially the same advantages and disadvantages, except that the CTE of the solder columns to withstand the stress generated by different, can be used in large-size package.

TBGA

Double layer with the metal support, the use of flip-chip connection technology.

Pros: You can achieve a smaller and lighter package; suitable for I / O count can be more packages; has good electrical properties; suitable for batch electronic assembly; solder joint reliability.

Disadvantages: easy to absorb moisture; higher packaging costs.