Main performance:

1. It is used for melting / heating solder balls on BGA / QFN / POP...

2. Similar to reflow oven, fully meet the requirements of ISO-9000.

3. Micro computer control, easy to operate on the platform.

4. Multi-safety protection.

Main specifications:

1.     Heating area: 120MM×200MM

2.     Power consumption: 600W

3.     Power supply: AC220V

4.     Dimension: 310MM×280MM×145MM(L×W×H)

5.     Weight: About 7.5Kg

Packing DImension: 34*31*21CM(L*W*H)

Gross Wight: 9KG

Please refer to reballing video: http://youtu.be/o4dJF74KKrU